Data centers are increasingly required to deliver higher computing performance while reducing energy consumption and environmental impact, and cooling technologies are now at a major turning point. As rack‑level power density continues to rise, air cooling alone is no longer sufficient, and direct‑to‑chip liquid cooling (DLC) is becoming a key technology for the future. While attention often focuses on chips and servers, the piping infrastructure that supports DLC plays an equally critical role. The choice of piping materials directly affects flow performance, coolant purity, system reliability, and overall sustainability. In this presentation, we will discuss the unique requirements of DLC piping systems, the key considerations for material selection that can determine the success of a system, and how appropriate solutions can help prevent common challenges such as corrosion, contamination, reduced fluid efficiency, installation complexity, and environmental impact.