• on-demand

B2-03

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Thematic Seminar

Electronic Design & EDA Track

This track is a specialized focused on electronic design and semiconductor design in system development. We will introduce the latest information from the world's leading semiconductor manufacturers, and the latest information on electronic device development from domestic semiconductor-related companies. Not only semiconductor designers, but also electronic device designers and embedded software developers have a lot of must-see contents. ■13:00~13:30 Invited Session <Title> Design Technology Platform initiatives in the cutting-edge FinFET technologies and beyond <Speaker> TSMC Design Technology Japan, Inc. Koji Nii ■13:30~13:50 Technical Session(1) <Title> Changes in the Cloud for Semiconductor and Electronic Equipment Design to Support Telework - On-premise, Public Cloud, Hybrid Cloud and Local Cloud as Design Environments - <Speaker> CDC, Inc. Yoshio Inoue ■13:50~14:10 Technical Session(2) <Title> How to use the commecial Microcomputer boards <Speaker> Flatoak Co., Ltd. Tasuku Kashihira ■14:10~14:30 Technical Session(3) <Title> Introduction of the Sensor AFE LSI development and its application embedded in IoT platform <Speaker> CM Engineering Co., Ltd. Takeshi SUZUKI ■14:30~14:50 Technical Session(4) <Title> Board Planning Step Is Key For SI/PI Early Estimation In System-Semiconductor Development Flow <Speaker> Gem Design Technologies, Inc. Hiroshi Murata ■14:50~15:10 Technical Session(5) <Title> Development of embedded software to control semiconductors and electronic devices -Effective verification method in embedded software development- <Speaker> InterBuddy Inc. Hideaki HONTAO ■15:10~15:40 Invited Session <Title> GF Foundry Strategy <Speaker> GLOBALFOUNDRIES Japan Ltd. Hiroshi Takada
  • Electronic Design & EDA
Speaker

TSMC Design Technology Japan, Inc.

Director, Japan Memory Design Program, Memory Solution Division

Koji Nii

Koji Nii received the B.E. and M.E. degrees from Tokushima Univ., and the Ph.D. degree from Kobe Univ. in 2008. In 1990, he joined Mitsubishi Electric Corp., and he was transferred to Renesas Technology Corp. in 2003, Renesas Electronics Corp. in 2010, where he has been worked on the research and development of embedded SRAMs, TCAMs, ROMs on 28nm to 0.8um bulk/SOI CMOSs and advanced 7-16nm FinFETs. In 2018, he joined Floadia Corp., which is an embedded Flash IP company in Tokyo. He is now with TSMC Design Technology Japan, Inc., in charge of a head of memory design team for developing advanced FinFET SRAM compilers, and custom cache SRAMs, Register files and computing-in-memory IPs. His current responsibility is Director, Japan Memory Design Program, Memory Solution Division. Dr. Nii holds over 100 US patents and over 150 papers/presentations at major int’l journals/conferences.

Speaker

CDC, Inc.

CEO & CTO

Yoshio Inoue

After joining Mitsubishi Electric, he was transferred to Mitsubishi Electric America, Inc. EDA for high-speed SoC Develop design systems with EDA vendors and deploy design methodologies After transferring to Renesas Technology, worked at Renesas Electronics. 2011 Counselor, REVSONIC Co. Representative Director, CEO & CTO, CDC Research Institute, Inc. since April, 2008

Speaker

Flatoak Co., Ltd.

CEO

Tasuku Kashihira

Guraduating Chuo Univ. CEO of Sophia Systems. 2009, Established Flatoak Co., Ltd.

Speaker

CM Engineering Co., Ltd.

General Manager

Takeshi SUZUKI

Takeshi Suzuki received the master degree from graduate school of engineering, Hiroshima University. One of his research themes was LSI global routing algorithm and he engaged the LSI layout design and SoC development in OKI Electric Industry and OKI Network LSI by taking advangate of his research. He is now engaged in IoT system development and business development activities in CM Engineering Co., Ltd.

Speaker

Gem Design Technologies, Inc.

President

Hiroshi Murata

After graduated from Kanazawa-Univ in 1980, he worked on circuit simulation in Komatsu-Murata Mfg, chip floorplan algorithm research in JAIST and U.C.Berkeley, chip block placer development in MicroArk, then started Gem Design Tech in 2008 to develop a board planning tool GemPackage.

Speaker

InterBuddy Inc.

CEO

Hideaki HONTAO

2002, President of TOOL Corp., R&D and business development of high-speed layout viewer. 2015, CEO, Established Interbuddy Inc. , develops solutions for electronic design and embedded software Working also ET Conference Committee and Japan EDA Venture Committee.

Speaker

GLOBALFOUNDRIES Japan Ltd.

Director Sales

Hiroshi Takada

Joined IBM Japan, Ltd. in 1992. Worked on real-time OS development at Fujisawa Office. From 2000 to 2002, he worked for US IBM developing network processors. After returning to Japan, he was in charge of the S/W development team in the Engineering & Technology Service Division. In 2009, he moved to the Microelectronics Division, and in 2015, he joined GlobalFoundries, which acquired IBM's Microelectronics business. In 2015, he joined GlobalFoundries Japan following GlobalFoundries' acquisition of IBM's Microelectronics business. He has been with GlobalFoundries Japan since then.

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