on-demand
TSMC Design Technology Japan, Inc.
Director, Japan Memory Design Program, Memory Solution Division
Koji Nii
Koji Nii received the B.E. and M.E. degrees from Tokushima Univ., and the Ph.D. degree from Kobe Univ. in 2008. In 1990, he joined Mitsubishi Electric Corp., and he was transferred to Renesas Technology Corp. in 2003, Renesas Electronics Corp. in 2010, where he has been worked on the research and development of embedded SRAMs, TCAMs, ROMs on 28nm to 0.8um bulk/SOI CMOSs and advanced 7-16nm FinFETs. In 2018, he joined Floadia Corp., which is an embedded Flash IP company in Tokyo. He is now with TSMC Design Technology Japan, Inc., in charge of a head of memory design team for developing advanced FinFET SRAM compilers, and custom cache SRAMs, Register files and computing-in-memory IPs. His current responsibility is Director, Japan Memory Design Program, Memory Solution Division. Dr. Nii holds over 100 US patents and over 150 papers/presentations at major int’l journals/conferences.
CDC, Inc.
CEO & CTO
Yoshio Inoue
After joining Mitsubishi Electric, he was transferred to Mitsubishi Electric America, Inc. EDA for high-speed SoC Develop design systems with EDA vendors and deploy design methodologies After transferring to Renesas Technology, worked at Renesas Electronics. 2011 Counselor, REVSONIC Co. Representative Director, CEO & CTO, CDC Research Institute, Inc. since April, 2008
Flatoak Co., Ltd.
CEO
Tasuku Kashihira
Guraduating Chuo Univ. CEO of Sophia Systems. 2009, Established Flatoak Co., Ltd.
CM Engineering Co., Ltd.
General Manager
Takeshi SUZUKI
Takeshi Suzuki received the master degree from graduate school of engineering, Hiroshima University. One of his research themes was LSI global routing algorithm and he engaged the LSI layout design and SoC development in OKI Electric Industry and OKI Network LSI by taking advangate of his research. He is now engaged in IoT system development and business development activities in CM Engineering Co., Ltd.
Gem Design Technologies, Inc.
President
Hiroshi Murata
After graduated from Kanazawa-Univ in 1980, he worked on circuit simulation in Komatsu-Murata Mfg, chip floorplan algorithm research in JAIST and U.C.Berkeley, chip block placer development in MicroArk, then started Gem Design Tech in 2008 to develop a board planning tool GemPackage.
InterBuddy Inc.
CEO
Hideaki HONTAO
2002, President of TOOL Corp., R&D and business development of high-speed layout viewer. 2015, CEO, Established Interbuddy Inc. , develops solutions for electronic design and embedded software Working also ET Conference Committee and Japan EDA Venture Committee.
GLOBALFOUNDRIES Japan Ltd.
Director Sales
Hiroshi Takada
Joined IBM Japan, Ltd. in 1992. Worked on real-time OS development at Fujisawa Office. From 2000 to 2002, he worked for US IBM developing network processors. After returning to Japan, he was in charge of the S/W development team in the Engineering & Technology Service Division. In 2009, he moved to the Microelectronics Division, and in 2015, he joined GlobalFoundries, which acquired IBM's Microelectronics business. In 2015, he joined GlobalFoundries Japan following GlobalFoundries' acquisition of IBM's Microelectronics business. He has been with GlobalFoundries Japan since then.