on-demand
Macnica,Inc.
CLAVIS Company
Mitsuo Hamada
Worked as a Field Application Engineer for EPC products (microcomputer, processor, wireless connectivity) of overseas semiconductor manufacturers since 2012. Conducted marketing activities for advanced sensing technologies such as millimeter wave radar and 3D ToF, while utilizing the knowledge of FAE. Currently engaged in social implementation of upgrading and improving efficiency in facility security by detecting abnormalities using AI image analysis.